ECD copper deposition is an important step in the damascene process. The vias or trenches are lined with a barrier layer of TiN or other dielectric barrier material. Next, a seed layer of copper is ...

Tin Plating Applying a tin surface to another material. (Not titanium nitride, see coatings section) Tin-lead Plating Tin-lead plating is an electroless plating process commonly used on circuit boards ...