来自MSN1 个月
Intel looks beyond silicon, outlines breakthroughs in atomically-thin 2D transistors, chip ...
Intel will also have an IEDM-invited talk about tomorrow's packaging solutions. This slide above revealed EMIB-T, which hasn't been disclosed previously. As a reminder, EMIB is Intel's Embedded ...
Neowin3 年
Here is Intel's architecture roadmap for 2025 and beyond0 0
Intel 7 - previously known as Enhanced SuperFin ... Embedded multi-die interconnect bridge (EMIB) has been used in products since 2017 and will continue to be used in Sapphire Rapids next ...
ZDNet7 个月
Moore's Law Under the Microscope: Intel Advances Process & Packaging
EMIB allows Intel to build out chips with an ever-increasing number of chiplets. The key is to build high-performance interconnects (think of these as circuit board traces, but running inside ...
CRN3 年
Intel’s $3.5B New Mexico Campus Upgrade To Boost Next-Gen Chips
The $3.5 billion upgrade will give Intel’s New Mexico manufacturing site the ability to produce next-generation processors with Intel’s Foveros 3D packaging technology, a key part of the ...
来自MSN1 个月
Leo Says Ep 63: INTEL ACCELERATED
Today Leo talks about the latest Intel Accelerated Briefing and gives ... looks ambitious - the Intel doctors talk 10:50 Next Gen EMIB 11:14 Meteor Lake with Foveros 11:38 Ponte Vecchio GPU ...