Accelerating multi-die, multi-chip SoC designs The Cadence® 112Gbps Extra Short Reach (XSR) SerDes IP for TSMC 7nm consists of eight lanes operating at 112Gigabit per second using PAM4 modulation.

TSMC is continuing to back the 7nm FinFET (Fin Field Effect Transistor) process for 5nm - essentially a "3D" non-planar transistor that, literally, resembles a fin, hence the name. However ...

Cadence 32G NRZ multi-protocol PHY The Cadence® 32/25Gbps Multi-Link and Multi-Protocol PHY IP for TSMC 7nm FinFET is a high-performance SerDes operating from 1.25Gbps to 32Gbps and specifically ...

“FinFET scaling reduces lateral dimensions to increase device density per unit area while increasing fin height as a way to improve device performance,” said Nerissa Draeger, director of university ...

TSMC started mass production of cutting edge 7nm process two years ago ... Previously it was rumoured that the firm may abandon the FinFET transistor process at the 3nm node and will instead ...

For the fourth quarter, 3nm contributed 15% of TSMC’s total wafer revenue, up from 6% in the third quarter of 2023. 5nm and 7nm accounted for 35% and 17% respectively in the fourth quarter and the ...

When combined with 5nm (32%) and 7nm (17%) contributions, advanced nodes now account for 69% of total wafer revenue. This technology mix is crucial because it showcases TSMC's unmatched ...

The story of the battle for semiconductors was the battle between Liang Mong Song of SMIC /Samsung vs Morris Chang of TSMC and the future of AI.

TSMC estimates 2025 capex at $38-42 billion with 70% spent on advanced processes ... In Q4, shipments of 3nm accounted for 26% of total wafer revenue; 5nm accounted for 34%; 7nm accounted for 14%.

But 2018 iPhones will have TSMC-made 7nm processors, which should be even faster and more energy-efficient. TSMC beat Samsung in the race to 7nm process volume production, a new Digitimes report says.