a new 3D chip integrating a commercial DRAM chip on top of a logic IC. The new 3D stack resembles as close as possible to future commercial chips. It consists of a 25µm thick logic die on top of which ...

Custom Materials, Inc., a leading innovator in advanced material solutions, is shaping the future of 3D Integrated Circuits (3D IC). The leading custom fabrications company is elevating its ...

But as we look toward the end of the decade, it seems likely that the world will see the emergence of 3D ... vertical capacitor in traditional DRAM designs creates very thick layers, making ...