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eeNews Europe
1 小时
Extreme low-power development platform for Wi-Fi
Development platform supports developers and researchers in creating extremely low power or ambient-powered Wi-Fi.
eeNews Europe
1 小时
5G automotive-grade module with NB-NTN support
G module to support advanced automotive OEM programs and enable satellite-based connectivity for vehicles starting production ...
eeNews Europe
1 小时
First nano-ridge GaAs lasers integrated into CMOS chip
The electrically-driven GaAs multi-quantum-well nano-ridge laser diodes are monolithically fabricated on 300mm silicon wafers ...
eeNews Europe
18 小时
Honda, Sony launch Afeela with microLED external display
With all the focus on the merger of Nissan, Honda and Mitsubishi, and the launch of the Honda Series 0 platform, spare a ...
eeNews Europe
18 小时
Gauzy launches black Suspended Particle (SPD) smart glass
Gauzy in Israel has developed an energy harvesting smart glass with black suspended particles for the first time.
eeNews Europe
23 小时
Two chip, 9-axis sensor for consumer wearables
TDK has launched a two chip, 9-axis sensor system for absolute orientation detection and fast sensor calibration at ultra-low ...
eeNews Europe
19 小时
Adaptive cameras for smart city monitoring
Researchers in South Korea have developed a smart city traffic monitoring system using adaptive cameras for more energy ...
eeNews Europe
23 小时
Vector signal generators offer enhanced EVM performance
Signal generators equipped with modified microwave hardware for enhanced EVM performance as well as higher output power.
eeNews Europe
23 小时
MOSFETs deliver lower on-resistance in small footprint
Renesas wafer technology enables MOSFETS with 30 percent lower on-resistance and 40 percent reduction in Gate-Drain charge.
eeNews Europe
20 小时
Americas region keeps growing chip sales as China slips
Europe's chip market was down 5.7 percent in November compared with a year before in a global chip market that achieved 20.7 ...
eeNews Europe
22 小时
COM-HPC module for high performance edge AI
Germany has launched a COM-HPC Computer-on-Module (COM) for power-hungry edge and infrastructure applications.
eeNews Europe
23 小时
$5.4m for next generation FD-SOI beamforming transceiver
Sivers Semiconductors has been awarded a $5.4m chip development project for a next generation highly-integrated mmWave ...
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